The MODULES SECTION of the SCT TDR __________________________________ Below we give a schematic of the MODULES section. This shows the section sub-headings, a brief (and sometimes incomplete) list of their contents, and with many items we have associated the name of at least one knowledgeable expert, who we hope will be willing to provide the basic input and/or suggest a colleague for that task. We would much appreciate having urgent feedback on our proposal, and it would be very helpful if those who are willing to contribute could confirm this fact to us as soon as possible. Nobu and Tony. _____________________________________________________________________________ MODULES SECTION 5.2.4 _____________________ 5.2.4.1 INTRODUCTION: There will be input from WWW "Module definition and performance..."| The basic requirements for physics studies, and triggering: review | of mechanical tolerances with respect to back-to-back strip | alignment needed in construction. Justification of Barrel stereo | angle, strip overlaps, etc, in conjunction with "Module | Requirements" document. | YU/AAC Basic requirements and mechanical tolerances | AbS Justification of Forward geometry and overlaps. | JNJ Overview of operation conditions. | YU Thermal cooling and prevention of runaway (with appropriate | referencing to detector section). | TK/TJ Choice of readout schemes: centre-tap barrel[F1], end-tap forward | [F2] | (justify with reference to WWW "Comparitive noise study"). | AAC A sumary table of main points.[T1] | YU/AAC 5.2.4.2 SPECIFICATION: Geometrical dimensions of modules, including active strip length | U/V stereo layout, relative wafer placements(50um dicing tolerance)| and location of glueing areas: | for Barrel,(with wafer schematic[F3]) | YU and for Forward, (to include variable strip lengths [plus comment on | maximum radiation level for each of the three forward rings, and | values])[F4] | TJ Electrical and power specifications for FE chips, and for detector | AAC operation, and | consequences on hybrid specification | CH Operation temperature and uniformity, and relation to coolant | temperature and interfacing | RA/AAC Summary table of items.[T2] | YU/AAC 5.2.4.3 MODULE DESIGN Schematic with full dimensions: all components shown individually | possibly in "pulled-apart mode"; to include information on the | following: detectors, baseboard [with information on BeO, plus PG | for Barrel, bushes, biassing details, fiducials around edge(6?)], | for Barrel,(Overall [F5.1], detailed figs [F5.2]) | AAC and | for Forward(Overall [F6.1], detailed figs [F6.2], ) | TJ Hybrid [with component footprints, kapton interconnect for Barrel | and scheme for connection, possible fiducials and possible peek | location pins wrt baseboard (2?)], pitch adapter and all other | passive components within envelope of module, and bond wire details| for Barrel[F7] | CH/PJ and | for Forward[F8] | NAS Summary table of components[T3] | YU/AAC 5.2.4.4 EXPECTED PERFORMANCE Electrical performance for binary readout with values of efficiency| occupancy and S/N [with note that these values are wrt prototype | results coming from existing chips and modules of similar but | different in detail from final versions] | for Barrel,[F9,F10,F11] | HFS and for Forward[F12,F13,F14] | JNJ Thermal FEA results for temperatures and distortions(with input | from WWW "Thermal.." page).Thermal runaway: discussion and | calculations, together with impact on coolant temperature and | results from prototype studies | for Barrel,[F15] | RA/TK and | for Forward[F16] | TJ 5.2.4.5 PROTOTYPE MEASUREMENTS Schematics to be given for each module referenced, to simplify text| Brief summary of results on Electrical modules (proposed new | notation), for Barrel : Centre-tap (KEK[LBIC])=> EBP1 [F17] | Centre-tap (LBL[CAFE])=> EBP2 [F18] | End-tap (KEK[LBIC])=> EBP3 [F19] | AAC and for Forward : End-tap (UK-F[LBIC])=> EFP1 [F20] | JNJ Centre-tap (Melb[LBIC])=> EFP2 [F21] | GTy Thermal profiles and distortions | for Barrel : Centre-tap (KEK)=> TBP1 [F22] | Centre-tap (UK-B)=>TBP2 [F23] | End-tap (KEK)=> TBP3 [single pipe and tiled][F24]| End-tap (UK-B)=>TBP4 [one and two pipe][F25] | SU/RA+? and for Forward : End-tap (UK-F)=>TFP1 [F26] | TJ Beam test results from H8 and elsewhere pre-1997: general summary | HFS/+?? [referenced wrt detector section] [F27, F28..] | Beam test results from KEK in Feb 1997 [Fn, Fn+1,....] | YU/+?? Results of glue irradiation tests | AAC Results of Kapton irradiation tests | SU 5.2.4.6 COMPONENT LIST Table of module components, to include numbers of detectors, FE | chips, baseboards, etc... for Barrel[T4] | AAC/RA and for Forward[T5] | TJ/JNJ General table of material properties for items used in module | construction [T6] | RA Table of component materials and their properties, including Xo to | calculate radiation length of complete module | for Barrel[T7] | RA and for Forward[T8] | TJ Effects of varying presence or proportions of various | sub-components of the modules: discussion and conclusions | AAC * The suggested figures and tables are indicated by [Fj], and [Tj] | respectively ****************************************************************************** The suggested colleagues whose initials are listed above include: TJ: Tim Jones, JNJ: Neil Jackson, TK: Taka Kondo, CH: Carl Haber, RA: Richard Apsimon, PJ: Pedja Jovanovic, NAS: Tony Smith, GTy: Geoff Taylor, HFS: Hartmut Sadrozinski, YU: Nobu Unno, AAC: Tony Carter, AbS: Abe Seiden, SU: Susumu Terada ****************************************************************************** We also plan to provide a contribution on "Systems tests and Prototype tests" that relate to the final outcome of the R&D phase of the SCT MODULE programme and the way it fits in with the long term construction programme. We would welcome input from any interested colleagues or names of volunteers to help finalise such a contribution. _____________________________________________________________________________ How we prepare the contributions: In order to avoid stragling the framemaker format, I would suggest: 1) we write the text with "Microsoft word" (or "Framemaker" itself, or any other editor which output can be read/imported into the framemaker) and 2) prepare separate files for the drawings and figures in "eps" format (not "ps" format). The "eps" is required because the figures has to be re-sized to fit in any size; "ps" file is simply not re-sizable.