Testings:
A hybrid based on a Cu/Polyimide FPC technique has been fabricated for the ATLAS SCT barrel module. The electronics chipset was LBIC + CDP + HAC. Fully populated prototype hybrids were used for the "centre-tap" and "end-tap" modules for electrical testing and detector/module evaluation in beam tests.
The layer construction of the prototype Cu/Polyimide hybrid, ATLAS FPC1.0, was 4 layers of 8 micron thick copper planes. The copper layer was glued on a 25 micron thick Polyimide sheet with adhesive of 10 to 25 micron thick. Basics of the design rules are as follows;
4 layers of 8 micron copper planes,
Minimum line width = 100 microns,
Minimum gap between the lines = 100 microns,
Through-hole (T.H.) diameter = 300 microns,
T.H. Land diameter = 500 microns.
k5Fb Gerber files, 02/01/11
k5Fb layouts (pdf), 01/11/15
New KB hybrid footprint, and Fanin corners, H. Pernegger, 02/11/05
Forward k4 hybrid substrate for straight split, (dxf, dwg), 00/12/15